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Focal Plane Assembly Process Engineer - Goleta California
Company: Raytheon Location: Goleta, California
Posted On: 11/12/2024
Date Posted: 2024-10-22 Country: United States of America Location: CA602: Goleta (RVS) Bldg B01 6825 Cortona Drive Building B01, Goleta, CA, 93117 USA Position Role Type: Onsite Posting Title: Focal Plane Assembly Process Engineer At Raytheon, the foundation of everything we do is rooted in our values and a higher calling - to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world. - Raytheon Vision Systems (RVS) is a world leader in the research, design, and manufacturing of focal plane arrays and flight-based vision systems. Our Focal Plane Operations Process Engineering department provides world class semiconductor and focal plane array manufacturing processes in support of production and development products across multiple domains. We have an opportunity for a talented Principal Process Engineer with a strong background in Flip Chip Bonding and Focal Plane processing. The ideal candidate will have familiarity with some, or all aspects of assembly technologies used in II-IV and III-V based semiconductor detector Focal Plane Array fabrication (also known as Sensor Chip Assembly). The candidate will work with other process engineers and skilled technicians to develop strategies, processes, tooling, and analysis for hybridization (Flip Chip Bonding), epoxy underfill, Anti Reflective Coating preparation and other common backend Focal Plane Assembly processes, utilizing and optimizing existing in-house systems and recommending/bringing in new capital equipment as required to meet technology, yield, and throughput requirements. The ideal candidate will have proficiency in interfacing with multiple functions, including Product Engineering, Systems Engineering, Quality, Mechanical Design Engineering, Factory Management, Equipment Engineering and Process Engineering What You Will Do - Supporting operational staff by providing technical expertise in Focal Plane fabrication
- Working with a diverse team of technicians and engineers in a semiconductor fabrication clean room setting.
- Maintaining current processes through standard statistical process control methods, optimizing existing processes to improve yield. Throughput or advance the technology, and continuously training and supporting technicians in use of said processes in a safe and efficient method
- Taking ownership and responsibility for the control, development and optimization of Focal Plane fabrication
- Trouble shoot and resolve processing or equipment issues in support of the manufacturing process goals while working to improve process yields. -
- Research new suppliers of equipment and technologies for improving production, quality, end cost and throughput.
- Partner with systems engineering and other support teams to define and prove in new tooling, and Focal Plane part designs. Qualifications You Must Have -
- Typically requires a degree in Science, Technology, Engineering, Mathematics, or a STEM degree in a related field and a minimum of 8 years' experience as a Process or Manufacturing Engineer in an Optics, Electro-Optics and/or Microelectronics environment or an advanced degree with 5 years of experience.
- The Ability to obtain and maintain a US Government issued clearance is required. U.S. Citizenship is required as only US citizens are eligible for a security clearance. Qualifications We Prefer
- Experience with Flip Chip bonders (Hybridizers), epoxy dispense machines, Anti Reflective Coating tooling and/or chambers, interferometers and other support equipment required for Focal Plane assembly.
- Hands on experience with FC-150 and FC-300 flip chip bonders; operation, programming and basic understanding of maintenance using Thermo compression and solder reflow processes, specifically with indium bump interconnects.
- Ability of solving technical problems, project ownership, meeting deadlines, and multitasking.
- Thorough sense of ownership, drive, and dedication to continuous improvement.
- Ability to work collaboratively with cross functional teams -to improve processes.
- Excellent verbal/written communication skills, including technical writing for summarizing data and findings, writing process and equipment specifications and work instructions.
- Detail-oriented with excellent organizational skills and project management experience What We Offer
- Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.
- Relocation Eligible - Relocation assistance is available. Learn More & Apply Now!
- RTX solves some of the toughest challenges in aerospace and defense. That requires expansive thinking and bold innovation - and that, in turn, requires a culture that is diverse, equitable and inclusive. We embrace individuality and diversity of thought to fuel opportunity for our employees, our customers, and our communities. We work toward progress, knowing that a more inclusive world is critical to our mission. Not just in this moment, but always.
- Please consider the following role type definition as you apply for this role.
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