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RF Mechanical Engineer II - Orlando Florida
Company: Raytheon Location: Orlando, Florida
Posted On: 11/01/2024
Date Posted: 2024-09-09 Country: United States of America Location: AZ852: RMS AP Bldg M02 1151 East Hermans Road Building M02, Tucson, AZ, 85756 USA Position Role Type: Onsite At Raytheon, the foundation of everything we do is rooted in our values and a higher calling - to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world. - The RF Mechanical Team at Raytheon is seeking a talented Engineer to join our team in Tucson, AZ. The candidate will be responsible for providing innovative design solutions for the packaging of antennas, RF Circuit Card Assemblies, radomes, and RF test equipment. The selected candidate will be expected to lead diverse multidiscipline teams, provide technical oversight, delegate tasks, and work with the Engineering organization to establish technology roadmaps, enable modernization, and contribute to general innovation. In addition, the candidate will work with customer personnel and program leadership to define and refine requirements to validate hardware compliance. The candidate will be responsible for providing guidance, coaching, mentoring, and training to other employees across the business within the candidate's areas of expertise. This position is an onsite role, located in Tucson, AZ. What You Will Do - Small team technical development
- Common and mature RF product development
- Serve as a technical resource to the organization - - - Qualifications You Must Have
- Typically requires a Bachelor's in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 2 years of prior relevant experience to include any combination of the following:
- Performing design and analysis for the packaging of RF products (e.g. Circuit Card Assemblies, antennas, radomes, RF test equipment, harnesses and interconnects) throughout the product life cycle to include three dimensional (3D) Computer Aided Design (CAD) software
- Creation of Technical Data Packages (TDPs) using Geometric Dimensioning and Tolerancing (GD&T) for RF products
- The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance. Qualifications We Prefer
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