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Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer - Baltimore Maryland
Company: Northrop Grumman
Location: Baltimore, Maryland
Posted On: 01/30/2025
Principal / Senior Principal Microelectronic Packaging Mechanical Design EngineerRequisition ID: R10177776 - Location: Baltimore, Maryland, United States of America
- Clearance Type: Secret
- Telecommute: Yes-May consider hybrid teleworking for this position
- Travel Required: Yes, 10% of the Time
- Relocation Assistance: Relocation assistance may be availableNorthrop Grumman Mission Systems is seeking a Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland.Overview:You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM, and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production.Roles and Responsibilities include:
- Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.
- Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
- Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
- Providing technical leadership and mentoring to less experienced personnel.This position may be filled as a Principal Microelectronic Packaging Mechanical Design Engineer or a Senior Principal Microelectronic Packaging Mechanical Design Engineer.This position is contingent on the ability to obtain/maintain a US Secret Clearance or higher and contract award.Basic Qualifications for Principal Microelectronic Packaging Mechanical Design Engineer:
- Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement.
- U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
- Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.
- Proficient with AutoCAD.
- Familiarity with NX or other 3D modeling software.Basic Qualifications Senior Principal Microelectronic Packaging Mechanical Design Engineer:
- Bachelor's degree with 8 years of experience, a Master's degree with 6 years of experience or a PhD with 3 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement.
- U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
- Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.
- Proficient with AutoCAD.
- Familiarity with NX or other 3D modeling software.Preferred Qualifications:
- Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
- Active DoD Secret Clearance or higher.
- Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.
- Familiarity with thermal and structural analysis considerations, methodologies, and software tools.
- Experience with hands-on assembly and testing of prototype electronic hardware.
- Experience in a technical leadership role on a cross-functional product development team.This positions standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including:
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